l features l outline ? l dimensions l specifications viewing angle 2 1/2 / 40 : standard typ. i f max. v r min. typ. i f (v) (ma) ( m a) (v) (mcd) (mcd) (ma) sla560ect 3.3 2000 sla560ec4t 3.2 1500 sla560bct 3.3 600 SLA560BC4T 3.2 470 sla560bd2t 1000 2200 1500 3300 * :duty1/10, 1khz sla560wbd2pt white blue 120 30 sla560ect/ec4t, sla560bct/bc4t, sla560bd2t/wbd2pt 470 l recommended solder pattern part no. emitting color power forward peak forward reverse operating temp. reverse current i r dominant wavelength l d luminous intensity i v typ. i f (ma) topr(oc) (nm) (ma) 5 100 20 525 527 200 tstg(oc) chip structure absolute maximum ratings (ta=25oc) viewing angle 2 1/2 : 40 i fp (ma) current v r (v) voltage dissipation current p d (mw) electrical and optical characteristics (ta=25oc) storage temp. forward voltag v f i f 20 610 ingan bluish green - 30 to + 100 126 - 20 to + 80 5 100* 20 3.2 3, .3) color type e b wb (unit : mm) tolerance : ? 0.2 (unit : mm) 1/6 2016.02 - rev.f downloaded from: http:/// data s he et www.rohm.com ? 2016 rohm co., ltd. all rights reserved.
www.rohm.com ? 2016 rohm co., ltd. all rights reserved. data sheet sla560ect/ec4t, sla560bct/bc4t, sla560bd2t/wbd2pt l electrical characteristics curves 1.5 1.0 0.5 0 20 10 30 0 sla560ect sla560ec4t sla560bct SLA560BC4T sla560bd2t sla560wbd2pt 2010 0 4030 -40 -20 0 20 40 60 80 100 sla560ect sla560ec4t sla560bct SLA560BC4T sla560bd2t sla560wbd2pt 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -40 -20 0 20 40 60 80 1 00 10 100 2.5 3.0 3.5 4 .0 1 fig.1 forward current - forward voltages forward current : i f [ma] forward voltage : v f [v] ta=25 oc fig.2 luminous intensity - atmosphere temperature relative luminous intensity [a.u.] atmosphere temperature : ta [oc] fig.3 luminous intensity - forward current forward current : i f [ma] ta=25 oc i f =20ma fig.4 derating ambient temperature : ta [oc] sla560ect sla560ec4t sla560bct SLA560BC4T sla560bd2t sla560wbd2pt relative luminous intensity [a.u.] maximum forward current : i f max. [ma] sla560ect sla560ec4t sla560bct SLA560BC4T sla560bd2t sla560wbd2pt 2/6 2016.02 - rev.f downloaded from: http:///
www.rohm.com ? 2016 rohm co., ltd. all rights reserved. data sheet sla560ect/ec4t, sla560bct/bc4t, sla560bd2t/wbd2pt l viewing angle l rank reference of brightness l part no. construction green(e) (ta=25oc, i f 20ma) xl xm xn xp xq xr xs xt xu 470 to 680 680 to 1000 1000 to 1500 1500 to 2200 2200 to 3300 3300 to 4700 4700 to 6800 6800 to 10000 10000 to 15000 blue (b) (ta=25oc, i f 20ma) xh xj xk xl xm xn xp xq xr xs xt xu 150 to 220 220 to 330 330 to 470 470 to 680 680 to 1000 1000 to 1500 1500 to 2200 2200 to 3300 3300 to 4700 4700 to 6800 6800 to 10000 10000 to 15000 SLA560BC4T white (wb) (ta=25oc, i f 20ma) xh xj xk xl xm xn xp xq xr xs xt xu 150 to 220 220 to 330 330 to 470 470 to 680 680 to 1000 1000 to 1500 1500 to 2200 2200 to 3300 3300 to 4700 4700 to 6800 6800 to 10000 10000 to 15000 * brightness on specification sheet include tolerance of wit hin 10%. rank iv (mcd) sla560ec4t sla560ect rank sla560wbd2pt iv (mcd) sla560bct rank iv (mcd) sla560bd2t scanning angle (deg) relative intensity 10 10 20 20 40 50 70 80 40 50 70 80 0 50 100 50 100 0 30 60 90 30 60 90 sla560bct / ect SLA560BC4T / ec4t scanning angle (deg) relative intensity 10 10 20 20 40 50 70 80 40 50 70 80 0 50 100 50 100 0 30 60 90 30 60 90 sla560bd2t sla560wbd2pt 3/6 2016.02 - rev.f downloaded from: http:///
www.rohm.com ? 2016 rohm co., ltd. all rights reserved. data sheet < good > < no good > to be fixed < good > < no good > < good > < 2 lead pins type > < 3 lead pins type > < 2 lead pin type > < 3 lead pin type > min.1 5 min.4 5 min.1 5 min.45 die b ond i ng side min.4 5 to be fixed die bonding side 2016.02 - rev.f sla560ect/ec4t,sla560bct/bc4t,sla560bd2t/wbd2pt 4/6 l attention points in handling visual light emitting diode does not contain reinforcement materials such as glass fillers.therefore if sudden thermal and mechanical shock are given, destruction or inferiority of luminous intensity may occur. please take care of the handling. fixation method 1. attention points (1) please do not give excessive heat over storage temperature to resin. in case that the product has to be heated in oven for the glue fixing of surface mount pats, this led should be mounted after the glue fixing. (2) please avoid stress to resin at high temperature. 2. termination processing (1) in case of termination processing, please fix the termination (2) processing position, and process the reverse side of led body.if stress is given during processing, it may cause non-lighting failure. (3) please process before soldering. 3. assembly on pc board (1) in case of soldering on pcb, if the operation is done with stress, it may cause non-lighting failure during soldering or using.please design the through-holes of pcb suitable for lead pins space or lead pins space after formin to avoid the physical stress on resin. (2) using spacer between leds body and pcb is recommended. in case of direct mount on pcb(slr/sli-343 series), please take care about clinch of led pins to avoid the remained stress and solder heat stress. enough evaluation is requested before deciding assembly and soldering conditions. please consult with us if any problems in the evaluation stage. downloaded from: http:///
www.rohm.com ? 2016 rohm co., ltd. all rights reserved. data sheet ? unit : mm ? lead types : 0 .4mm 0. 5mm < 2lead pin type > < 3lead pin type/2.5mm pitch > < 3 lead pin ty pe/2.0 mm pitch > 2016.02 - rev.f sla560ect/ec4t,sla560bct/bc4t,sla560bd2t/wbd2pt 5/6 4. soldering (sn-3ag-0.5cu) (1) please make soldering rapidly under the following temperature and time conditions.(2) please avoid stress to led lamp during soldering. (3) in case of double peak flow soldering, the temperature gap during 1st and 2nd soldering to be less than 100 degree c. artiicle soldering temp operation time remarks soldering dip pre-heat max. 100oc 60sec max. - soldering bath max. 265oc 5sec max. in case of double peak flow soldering, the operation time is counted from the beginning of 1st peak to the end of 2nd peak. soldering iron max. 400oc 3sec max. the iron should not touch the leds body. 5. cleaning in case of cleaning, some solvents may cause damage of resin or cause non-lighting failure, so please check the solvent before actual use. the recommendable cleaning solvent is alcoholic one such as isopropyl alcohol. method conditions cleaning by solvent temperature of solvent : max. 45oc immersion time : max. 3min cleaning by solvent ultrasonic out : ultrasonic out cleaning time : max. 3min 6. recommendable round pattern round pattern depends on the material pcb, density and circuit arrangement.our recommendation is as follow : attention on storaging storage in dry box is most desirable, but if it is not possible, we recommend following conditions. article temperature humidity expiration date conditions 5 to 30oc max.60%rh within 1 year poor storage conditions may cause some failure as bellow. (1) lead pins may corrode if it is stored in the environment of high temperature and humidity and lead to defective soldering. (2) in case of soldering after leds body absorb moisture highly, destruction or inferiority of luminous intensity may occur. downloaded from: http:///
www.rohm.com ? 2016 rohm co., ltd. all rights reserved. data sheet 2016.02 - rev.f sla560ect/ec4t,sla560bct/bc4t,sla560bd2t/wbd2pt 6/6 application method 1. precaution for drive system and off mode ? design the circuit without the electric load exceeding the absolute maximum rating that applies on the products. ? if drive by constant voltage, it may cause current deviation of the led and result in deviation of luminous intensity, so we recommend to drive by constant current. (deviation of vf value will cause deviation of current in led.) ? furthermore, for off mode, please do not apply voltage neither forward nor reverse. especially, fo r the products with the ag-paste used in the die bonding, theres high possibility to cause electro migration and result in function failure. 2. operation life span theres possibility for intensity of light drop according to working conditions and environments (applied current, surrounding temperature and humidity, corrosive gases ), please call our sales staffs for inquiries about the concerned application below. (1) longtime intensity of light life (2) on mode all the time 3. usage the product is led. we are not responsible for the usage as the diode such as protection chip, rectifier, switching and so on. others 1. surrounding gas notice that if it is stored under the condition of acid gas (chlorine gas, sulfured gas) or alkali gas (ammonia), it may result in low soldering ability (caused by the change in quality of the plating surface ) or optical characteristics changes (light intensity, chrominance) and change in quality of die bonding (ag-paste) aterials. all of the above will cause function failure of the products. therefore, please pay attention to the storage environment for mounted product (concern the generated gas of the surrounding parts of the products and the atmospheric environment). 2. electrostatic damage the product is part of semiconductor and electrostatic sensitive, theres high possibility to be damaged by the electrostatic discharge. please take appropriate measures to avoid the static electricity from human body and earthing setting of production equipment. the resistance values of electrostatic discharge (actual values) are different varies with products, therefore, please call our sales staffs for inquiries. 3. electromagnetic wave please concern the influence on led in case of application with strong electromagnetic wave such as ih (induction heating). downloaded from: http:///
r1102 a www.rohm.com ? 2016 rohm co., ltd. all rights reserved. notice ro hm cu stome r s upport sy s tem h ttp :// www.r oh m .co m/ co n tact / thank you for your accessing to rohm product informations. more detail product informations and catalogs are available, please contact us. no tes the information contained herein is subject to change without notice. before you use our products, pl ease contact our sales representative and verify th e la tes t specifica - tion s : alt hou gh rohm is contin uous ly wor ki ng to im pr ove p ro du ct r eli a bility and qualit y, semicon - du c tor s c an bre a k d ow n and ma lf un ct io n du e to var io us f ac to rs. th e re fore, in or der to prevent pe r so nal in ju ry or fi re ar isi ng f ro m fa ilur e, please ta ke sa f ety mea s ur es su ch as com plyin g wi th th e de r at in g ch ara ct er ist ic s, impl e menting redundant and f ir e preve nt ion designs, and u tilizin g ba ck up s a nd f ail - sa fe p ro ce du re s. ro hm shall have no responsibility for any damages arising out of the use of our poducts b ey ond the rating specified by rohm. examples of application circuits, circuit constants and any other information contained herein are provided only to illustrate the standard usage and operations of the products. the peripheral conditions must be taken into account when designing circuits for mass production. the technical information specified herein is intended only to show the typical functions of and examples of application circuits for the products. rohm does not gr ant you, explicitly or implicitly, any license to use or exercise intellectual property or other rights held by rohm or any other parties. rohm shall have no responsibility whatsoever for any dispute arising out of the use of such technical information. the products are intended for use in general electronic equipment (i.e. av/oa devices, communi- cation, consumer systems, gaming/entertainment sets) as well as the applications indicated in this document. the products specified in this document are not designed to be radiation tolerant. for use of our products in applications requiring a high degree of reliability (as ex emplified bel ow), please contact and consult with a rohm representative : transportation equipment (i.e. cars, ships, trains), primary communication equipment, traffic lights, fire/crime prevention, safety equipment, medical systems, servers, solar cells, and power transmission systems. do not use our products in applications requiring extremely high reliability, such as aerospace equipment, nuclear power control systems, and submarine repeaters. rohm shall have no responsibility for any damages or injury arising from non-compliance with the recommended usage conditions and specifications contained herein. rohm has used reasonable care to ensur the accuracy of the information contained in this document. however, rohm does not warrants that such information is error-free, and rohm shall have no responsibility for any damages arising from any inaccuracy or misprint of such information. please use the products in accordance with any applicable environmental laws and regulations, such as the rohs directive. for more details, including rohs compatibility, please contact a rohm sales office. rohm shall have no responsibility for any damages or losses resulting non-compliance with any applicable laws or regulations. when providing our products and technologies contained in this document to other countries, you must abide by the procedures and provisions stipulated in all applicable export laws and regulations, including without limitation the us export administration regulations and the foreign exchange and foreign trade act. this document, in part or in whole, may not be reprinted or reproduced without prior consent of rohm. 1) 2) 3) 4) 5) 6) 7) 8) 9) 10)11) 12) 13) 14) downloaded from: http:///
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